ALPHA OM550 OM535 OM520 solder paste 138℃

Product description

ALPHA OM-520, OM-550, and OM-535 are zero-halogen, lead-free, ROL0, no-clean, low-temperature solder pastes specifically designed for the through-hole soldering assembly of heat-sensitive components. Electronics assemblers can use it to reduce or eliminate wave soldering or selective soldering processes when using hybrid technology. Low-temperature solder paste ALPHA solder paste provides low reflow temperature while providing an extremely high yield of printing and reflow processes in through-hole packaging applications. In addition, it can print as small as 0.30 mm (0.12 in.) circular pads at speeds up to 100 mm/s (4 in./s). The online test of ALPHA solder paste has a high pass rate and meets the requirements of IPC, Bellcore and JIS electrical reliability standards. It has excellent anti-cavity performance, full and bright solder joints, high electrical reliability, and high-cost performance.

Advantages of ALPHA lead-free solder paste:

1. Eliminates damage to temperature-sensitive components and connectors by eliminating the need for peaking or selective steps;

2. The cycle time of the reflow process is significantly reduced;

3. Reduced energy consumption;

4. A no-clean solder paste, the residue after soldering is colorless, transparent, and easy to penetrate;

5. With good needle side performance, it is suitable for automatic test equipment testing;

6. The residue is soft and non-sticky, which reduces the false detection rate in needle testing;

7. The temperature adaptation range is more expansive and has good process compatibility. As a result, boards with complex designs are easier to get good welding results.

Product parameters:

Key differences between the three solder pastes:

1. OM520 (SnBi0.4Ag): A classic low-temperature Sn-Bi-Ag alloy with a melting point below 140°C and a wide reflow window. It features clean, transparent residue and high insulation reliability, making it suitable for multiple reflow cycles or secondary assembly.

2. OM550 (HRL1 proprietary alloy): A non-eutectic low-temperature alloy specifically improved by Alpha; it has a liquidus temperature of approximately 170°C and a recommended peak temperature of 175°C. Its standout feature is significantly improved drop-shock and thermal cycling performance compared to traditional Sn-Bi alloys, alongside greatly reduced PCB/chip warpage. It specifically addresses yield issues such as BGA/large-package warpage, Head-in-Pillow (HIP), and Non-Wet-Open (NWO) defects, offering the highest mechanical reliability of the three.

3. OM535 (SnBi1.0Ag): Also features a melting point <140°C and a reflow temperature range similar to OM520. However, it utilizes a different flux system that leaves yellowish residue. Its advantages lie in its suitability for the lowest temperature ranges, targeting applications such as photovoltaics, ultra-thin substrates, and extremely temperature-sensitive components.

Selection recommendations:

1. Choose OM550 for: BGA/LGA/MLF components, chips prone to warpage, applications requiring drop/thermal cycling resistance and low voiding, and high-reliability motherboards or modules.

2. Choose OM520 for: Multiple reflow cycles, secondary assembly, requirements for transparent residue and ICT (In-Circuit Testing), and consumer electronics with moderate mechanical requirements for solder joints.

3. Choose OM535 for: Photovoltaics, ultra-thin substrates, and extremely heat-sensitive components where the product does not face stringent drop-shock or long-term thermal cycling reliability requirements.

Due to the pastes and liquids are sensitive goods and their transportation is restricted, this product will be shipped separately using sensitive goods channels, and the delivery time will be slightly longer 8 to 20 working days.

Scope of application:

ALPHA leads the technical trend of solder paste product development to meet the requirements of today's increasingly complex SMT process. ALPHA solder pastes can be used to assemble printed circuit boards for various product applications, including soldering handheld electronic devices, computers, consumer electronics, network servers, automotive systems, medical and military equipment, and many others.

Product display

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