183℃ medium temperature solder paste 30g 50g 100g

Product description

183℃ Sn63Pb37 medium temperature solder paste is fine and full of solder joints. It is suitable for dense pin IC on PCB, BGA tin planting, LED patch, cable soldering, capacitor and resistor syringe design, and welding is not wasted.

Storage temperature: 0~10℃ recommended

Steps for usage:

Turn counterclockwise to open the cap;

Turn clockwise to install the needle;

Open the bottom cover;

Install the push rod and you are ready to use.

Due to the pastes and liquids are sensitive goods and their transportation is restricted, this product will be shipped separately using sensitive goods channels, and the delivery time will be slightly longer 8 to 20 working days.

Operation and Precautions:

1. The storage of solder paste should be controlled under the environment of 2-10 ℃, and the service life of solder paste is six months (unopened);

2. Solder paste should not be placed in sunlight;

3. Before opening the package, the temperature of the solder paste must be raised to the ambient temperature (25+3°C), the heating time is 3-4 hours, and the use of other heaters to instantly increase the temperature is prohibited;

4. After returning to temperature, it must be fully stirred. The stirring time of the mixer is about 1-3 minutes, depending on the type of mixer;

5. When using the unused solder paste from the previous batch, remember to stir it first. If it is found that it is dry and inconvenient to stir, you can add a small amount of special thinner for solder paste before stirring, and stir it evenly before use;

6. Add an appropriate amount of solder paste to the dry steel plate, and try to keep the amount of solder paste not exceeding the can to the steel plate;

7. Depending on the production speed, supplement the amount of solder paste on the steel plate by adding a small amount of times to maintain the quality of the solder paste;

8. Solder paste that has not been used on the day should not be placed with the unused solder paste. It is recommended that the solder paste be used within 24 hours after opening;

9. After the solder paste is printed on the substrate, it is recommended to mount the components within 4-6 hours and enter the reflow soldering to complete the soldering;

10. If the line is changed for more than one hour, please scrape the solder paste from the steel plate and pack it in a solder paste can before changing the line;

11. In order to achieve the best welding effect, the indoor temperature should be controlled at 22-28℃, and the temperature should be RH40-60%.

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