Silicone potting AB glue insulation heat conduction waterproof

Product description

Circuit board insulation heat conduction waterproof AB glue for Antminer Whatsminer air cooling Hydro cooling or immersion cooling PSU

This is a 1:1 organic silicone for Antminer, Whatsminer, Avalon, Iceriver, etc. air-cooled, water-cooled, and oil-cooled power supplies. It has the characteristics of insulation sealing, high and low-temperature resistance, no bubbles after curing, good fluidity, waterproof and moisture-proof, good thermal conductivity, etc. It can effectively protect the sensitive circuits on the power supply board and provide long-term and effective protection for electronic modules, complex electronic circuits, etc.

Due to the pastes and liquids are sensitive goods and their transportation is restricted, this product will be shipped separately using sensitive goods channels, and the delivery time will be slightly longer 8 to 20 working days.

Net weight: 2kg

Gross weight: 2.5kg

Product features:

1) Protect sensitive circuits and provide long-term and effective protection for electronic modules and equipment, complex structures and shapes, etc.;

2) Sealed insulation does not leak electricity, has insulation characteristics after curing, good sealing, and greatly improves the stability of the equipment;

3) After curing, it can be easily repaired. The sealed components can be easily removed for repair and replacement and then repaired with this potting glue without leaving any traces;

Product parameter:

How to use:

1) Before mixing, stir components A and B in their respective containers.

2) When mixing, the weight ratio of component A: component B = 1:1 should be followed and stirred evenly.

3) Potting and degassing, the mixed glue should be poured into the product as soon as possible to prevent the glue's fluidity from decreasing over time. After pouring into the power supply, the vacuum should degass for 1-3 minutes, and the air pressure should be controlled below -0.08MPa.

4) Curing, it can be cured at room temperature or heated. The higher the temperature, the faster the curing speed. When the temperature is low, the room-temperature curing time will be extended. It is recommended to use heating to cure. When curing by heating, in order to prevent obvious expansion, the glue should be placed at room temperature for more than 1 hour after pouring and gradually heated to cure. After heating to 80°C, it can be cured for 40-50 minutes.